Cleveland CBX Full-Face 2 Tour Satin Golfmaila - wedge

CBX Full-Face 2 Wedges feature heel-to-toe grooves across the largest striking area ever in a CBX wedge so you can hit more challenging shots with confidence. From full swings to tricky open-face plays around the green, CBX Full-Face 2 is designed to deliver full forgiveness and full fun.

HYDRAZIP

• HydraZip technology features dynamic face blasts formulated to create mighty surface textures that maximize friction for improved spin consistency in wet or dry conditions.
• In the CBX Full-Face 2 lineup, loft groupings 50° – 52° and 54° – 60° receive different blast media and laser patterns. Lower lofts receive a less rough blast, while higher lofts receive a rougher blast and more laser lines for more consistent dry and wet spin performance across the course.

ZIPCORE

• Set in the heart of the Wedge, ZipCore is a new addition for CBX Full-Face 2. Proprietary, lightweight and low-density core technology, ZipCore reduces vibrations while also perfecting the Center of Gravity and boosting MOI for increased feel, control, consistency and forgiveness.

ULTIZIP

• UltiZip's network of sharp, deep, and tightly spaced grooves enhances spin characteristics for purer performance on every strike. This series is equipped with the sharpest groove radii ever in a CBX Wedge, imparting more spin and more control into all your shots.

LARGER FULL-FACE PROFILE

• Hit more extreme, open-face shots with a larger face size—the largest contact area ever on a CBX Wedge. Plus, with 13 % more contact area than RTX Full-Face, that means more grooves from hosel to toe for more forgiveness, no matter where you strike it.

FORGIVING SOLE GRINDS

• A new full-sole design with a higher bounce on 50° and 52° lofts provides optimal forgiveness on full swing shots. The C-Shaped sole, featured on 54° – 60° lofts, has added bounce in the center and less in the heel for forgiveness and greenside versatility.
• All sole grinds also feature a new leading-edge bounce chamfer that helps reduce chunking on challenging chips.